JPH01127776U - - Google Patents
Info
- Publication number
- JPH01127776U JPH01127776U JP2088788U JP2088788U JPH01127776U JP H01127776 U JPH01127776 U JP H01127776U JP 2088788 U JP2088788 U JP 2088788U JP 2088788 U JP2088788 U JP 2088788U JP H01127776 U JPH01127776 U JP H01127776U
- Authority
- JP
- Japan
- Prior art keywords
- postcard
- outer periphery
- featuring
- pasting
- folded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2088788U JPH01127776U (en]) | 1988-02-19 | 1988-02-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2088788U JPH01127776U (en]) | 1988-02-19 | 1988-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01127776U true JPH01127776U (en]) | 1989-08-31 |
Family
ID=31237636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2088788U Pending JPH01127776U (en]) | 1988-02-19 | 1988-02-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01127776U (en]) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH079971U (ja) * | 1993-07-05 | 1995-02-10 | 日電アネルバ株式会社 | バイアススパッタ装置 |
-
1988
- 1988-02-19 JP JP2088788U patent/JPH01127776U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH079971U (ja) * | 1993-07-05 | 1995-02-10 | 日電アネルバ株式会社 | バイアススパッタ装置 |